Features
Physical Properties
Features
Applications
| Thickness |
0.381 mm
0.635 mm
0.79 mm
1.27 mm
1.575 mm
|
| Colors |
White
|
- High bond strength and low thermal resistance in applications with uneven surfaces such as non-flat heat sinks
- Effectively bonds plastic BGA surfaces that may have silicone mould release contamination
- The unique silicone compound provides excellent bond strength to a wide range of substrates, including plastic BGAs, anodised aluminium and nickel plated heat sinks, which can eliminate mechanical fasteners and less secure tapes
- The resilient silicone compound provides good vibration isolation for components that also need thermal transfer
- Product is supplied in an easy-to-use roll that ensures the correct amount of bonding and heat transfer material is provided without waste or the need for special assembly equipment
-
Automotive electronics
-
Computers
-
CD-ROM cooling
-
Electrical insulation
-
Military
-
Medical
-
Heat pipe assemblies
-
Telecommunication
-
Electronic modules for power devices for power supplies
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