Products
Spacer Tapes
ThermaCool-TC100-B-MCO

TC100U

ThermaCool TC100U is an uncured (B-Stage) unsupported thermally conductive solid silicone rubber. This unique thermally conductive silicone gap filler can be used to effectively bond small passive heat sinks to BGA chips.

Caractéristiques
Propriétés physiques
Thickness
0,381 mm
0,635 mm
0,79 mm
1,27 mm
1,575 mm
Colors
White
Caractéristiques
  • High bond strength and low thermal resistance in applications with uneven surfaces such as non-flat heat sinks
  • Effectively bonds plastic BGA surfaces that may have silicone mold release contamination
  • The unique silicone compound provides excellent bond strength to a wide range of substrates including plastic BGAs, anodized aluminium and nickel plated heat sinks which can eliminate mechanical fasteners and less secure tapes
  • The resilient silicone compound provides good vibration isolation of components that also needs thermal transfer
  • Product is supplied in an easy to use roll that ensures the correct amount of bonding and heat transfer material is provided without waste or need for special assembly equipment
Applications

  • Automotive Electronics

  • Computers

  • CD-ROM Cooling

  • Electrical Insulation

  • Military

  • Medical

  • Heat Pipe Assemblies

  • Telecommunication

  • Electronic modules for power devices for power supplies

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