Advanced Tape Solutions for AI Data Centers
The rapid expansion of Artificial Intelligence into our home and workplaces is reshaping the demand for data center infrastructure, creating extreme demands for energy, HVAC and instrumentation. Data center growth faces mounting challenges, including grid limitations that cause multi-year delays, cooling systems consuming up to 50% of total energy, water-intensive processes in drought-prone regions, and supply chain bottlenecks that slow the deployment of critical infrastructure.
At the same time, the regulatory landscape is shifting in favor of more efficient operations and increased reliance on renewable energy sources. In this high-stakes environment, advanced material solutions play a quiet but essential role, helping manage heat, protect sensitive components, and improve energy efficiency.
Saint-Gobain Tape Solutions delivers innovative solutions across four critical segments to help overcome these challenges:
Environmental sealing, acoustic attenuation and modular construction solutions for data center fit-outs. Our materials contribute to compartmentation, waterproofing, and noise reduction, enabling efficient and safe construction for modern data center facilities.
Materials for use in applications throughout the battery system, including materials to mitigate thermal runaway, control flame propagation, provide cell cushioning and pack sealing for compliance with safety standards. These solutions enhance resilience and safety in high-power energy storage applications, ensuring operational reliability.
Materials designed for efficient heat dissipation at high rack densities, UL94 V-0 safety compliance, and compatibility with immersion cooling systems. Our solutions include thermal interface materials and silicone sealing and gasketing products, which maintain performance under compression and harsh conditions.
Solutions that provide superior insulation performance under harsh environmental conditions. Our materials ensure maximum up-time and reliable performance in critical power and instrumentation systems.
These opportunities are essential for building reliable, scalable, and sustainable data center infrastructure, helping the industry address power, cooling, and safety challenges while supporting the evolution toward high-density, AI-ready environments.
Open Compute Project (OCP) Member: Data Center Materials Partner
Saint-Gobain is a Bronze Member of the Open Compute Project (OCP), a global, open-source community working to advance scalable, efficient, and sustainable data center infrastructure. As an OCP member, we align our materials science expertise with the evolving needs of modern data centers, supporting solutions for thermal management, electrical insulation, gasketing, sealing, and durability in demanding operating environments. OCP brings together data center operators, equipment manufacturers, and technology suppliers to drive open standards and best practices. Our participation reflects our commitment to industry collaboration, performance-driven materials, and long-term reliability in data center applications. We work closely with customers to support next-generation data center designs, where energy efficiency, uptime, and sustainability are critical.
